Reinvent Wireless Silicon: Staff RF/Mixed-Signal IC Engineer – Lead Wi-R SoC Design

📍 On‑site – West Lafayette, IN | Competitive Base + Meaningful Equity

✈️ We provide relocation packages and visa transfers (if required) for engineers currently in the San Francisco Bay Area and other U.S. hubs.

🚀 About Ixana

Ixana is a Purdue University spinoff pioneering brain-inspired wearable computing. We've developed Wi-R, a patented communication tech that's 100x more energy-efficient than Bluetooth or Wi-Fi. Join our 60-person team building the next era of real-time, AI-powered human-computer interaction.

💡 The Wi-R Revolution

Wi-R is our patented non-radiative near-field communication technology that creates secure "wire-like wireless" experiences through small E-field bubbles around your body. This breakthrough enables unprecedented energy efficiency at sub-0.1 nanojoules per bit, making long-term wearable and implantable devices finally practical.

See Wi-R in action: Visit ixana.ai for demos of high-speed data streaming through skin contact: https://vimeo.com/ixana/pairing-contact-transfer

What You’ll Do

• Lead design, verification, and integration of analog and mixed-signal IPs into Wi-R SoCs

• Own RF IC development from architecture to post-silicon bring-up

• Collaborate across firmware, digital, and board teams for optimal performance

• Mentor junior engineers and drive long-term technical strategy

• Publish and document work with conference-level rigor

What We're Looking For

• Experience leading 2+ successful analog/mixed-signal tapeouts

• PhD in Analog/Mixed Signal Design OR MS with 7+ years industry experience

• Expertise in wireless communication ICs

• ISSCC, JSSC, CICC, VLSI publications (or equivalent chip-lead experience)

Preferred

• Familiarity with ADS, LTSpice, or similar tools

• Board-level and firmware debugging skills

• Experience with Altium, Eagle, or OrCAD

• Python or LabVIEW scripting for automation

• Hands-on use of scopes, signal generators, and RF lab tools

💰 Compensation & Benefits

• Base salary: $160K–$190K – equivalent to ≈ $250K+ Bay‑Area purchasing power
• + Performance bonus + meaningful early‑stage equity
• Relocation bonus, partner job‑search help
• Full visa sponsorship (STEM‑OPT transfer / H‑1B / TN / future green card)
• Medical, dental, vision, 401(k), generous PTO, inventor cash awards

🌟 Why Join Us

• Work on deep tech that matters

• Collaborate with world-class experts and industry leaders

• Own your work end-to-end and see real impact

• Enjoy a culture of speed, rigor, and respect

• Competitive salary, equity, and global exposure

📍 Location
West Lafayette, IN – Based at our HQ near Purdue University. Relocation and local area orientation provided.

📢 Application Requirements

• Resume

• Links to ISSCC/JSSC/CICC/VLSI publications or summary of chip tapeout contributions

• [Optional] Portfolio or presentation slides explaining your design ownership

Ready to re‑wire wireless?
Apply via our careers page. In your note, tell us how you’d push the limits of Wi-R chip design.

Ixana is an equal opportunity employer committed to advancing human-computer interfaces through innovative low-power electronics innovation.

Keywords:
RF IC Design, Mixed Signal, Analog Design, IC Tapeout, SoC, ISSCC, JSSC, VLSI, Wi-R, Startup, Equity, Ultra-Low Power, Wearables